GST412W is one of the Wafer Level Packing (WLP) uncooled LWIR detectors developed by Global Sensor Technology (GST). Its resolution is 400×300 with pixel size at 12μm.
Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector.
Thanks to the WLP technology, the GST412W thermal infrared detector produces clear infrared thermal image up to 120,000 pixels without compromise in size, which enables wide application in almost all popular applications such as thermography, security monitoring, firefighting, autonomous driving, personal vision etc.
Global Sensor Technology is an OEM infrared detectors & thermal imaging camera module manufacturer. Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for WLP infrared camera detectors developed by GST to be integrated into more terminal products and greatly reduces the cost for customers.
Model | GST412W |
Sensitive Material | VOx |
Resolution | 400×300 |
Pixel Size | 12μm |
Spectral Range | 8-14μm |
Typical NETD | <40mK |
Digital Output | Built-in 14 bits ADC |
Typical Responsivity | 15mV/K |
Thermal Response Time | <12ms |
Frame Rate | 50Hz |
Size (mm) | 18×16×2.8 |
Weight | <1.5g |
Operation Temperature | -40°C ~ +85°C |
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