GST612W is one of the Wafer Level Packing (WLP) uncooled infrared detectors developed by Global Sensor Technology (GST). Its resolution is 640x512 with pixel size at 12μm.
Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector.
Thanks to the WLP technology, the GST612W FPA detector produces clear infrared thermal imaging up to 327,680 pixels without compromise in size, which makes it the mainstream product in the market with wide application in almost all popular applications such as thermography, security monitoring, firefighting, autonomous driving, personal vision etc.
Global Sensor Technology is a supplier of cooled uncooled infrared detectors and infrared thermal imaging modules. These infrared FPA detectors and thermal camera modules are partial components of infrared thermal cameras, which are specially used for the secondary development requirements of the customers.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for WLP IR detectors developed by GST to be integrated into more terminal products and greatly reduces the cost for customers.
Security & Monitoring
Elevated Skin Temperature
|Digital Output||Built-in 14 bits ADC|
|Thermal Response Time||<12ms|
|Operation Temperature||-40°C ~ +85°C|
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